內(nèi)窺鏡設(shè)備維修融合多領(lǐng)域?qū)I(yè)技術(shù)，針對不同核心部件，需運(yùn)用特定技術(shù)手段保障維修質(zhì)量，滿足臨床使用標(biāo)準(zhǔn)。

　　The maintenance of endoscopic equipment integrates multiple professional technologies from different fields, and specific technical means need to be used to ensure the quality of maintenance for different core components, meeting clinical usage standards.

　　一、光學(xué)系統(tǒng)維修技術(shù)

　　1、 Optical system maintenance technology

　　鏡頭修復(fù)：在百級潔凈車間操作，用干涉儀檢測鏡片平面度（偏差≤0.001mm），光譜儀確保透光率≥90%。拆卸用鈦合金鑷子，按序記錄鏡片位置；清潔用 99.9% 無水乙醇浸潤鏡頭紙，螺旋式輕擦去除污漬。

　　Lens repair: Operate in a Class 100 clean room, use an interferometer to detect the flatness of the lens (deviation ≤ 0.001mm), and use a spectrometer to ensure a transmittance of ≥ 90%. Disassemble with titanium alloy tweezers and record the position of the lens in sequence; Soak the lens paper in 99.9% anhydrous ethanol for cleaning, and use a spiral light wipe to remove stains.

　　光纖束處理：顯微鏡（50-100 倍）定位斷纖，斷纖率＜5% 可梳理修復(fù)，過高則需更換。新光纖束排列偏差≤0.01mm，兩端研磨拋光至粗糙度 Ra≤0.02μm，保證光傳輸效率。

　　Fiber bundle processing: Microscope (50-100x) locates broken fibers. If the fiber breakage rate is less than 5%, it can be combed and repaired. If it is too high, it needs to be replaced. The deviation of the new fiber bundle arrangement is ≤ 0.01mm, and both ends are ground and polished to a roughness Ra ≤ 0.02 μ m to ensure optical transmission efficiency.

　　二、電子系統(tǒng)修復(fù)技術(shù)

　　2、 Electronic system repair technology

　　傳感器與電路維修：防靜電環(huán)境操作（接地電阻≤1Ω），示波器檢測傳感器信號（電壓波動≤5mV），熱風(fēng)槍（80-100℃）軟化焊點(diǎn)拆卸。電路板故障用萬用表檢測，元件更換需匹配型號（如貼片電容誤差≤5%），320-350℃恒溫烙鐵焊接，放大鏡檢查焊點(diǎn)質(zhì)量。

　　Sensor and circuit maintenance: Anti static environment operation (grounding resistance ≤ 1 Ω), oscilloscope detection of sensor signal (voltage fluctuation ≤ 5mV), hot air gun (80-100 ℃) softening and welding point disassembly. Use a multimeter to detect circuit board faults, and replace components with matching models (such as surface mount capacitor error ≤ 5%). Use a constant temperature soldering iron to solder at 320-350 ℃, and inspect the quality of solder joints with a magnifying glass.

　　圖像校準(zhǔn)：通過專用軟件校準(zhǔn)白平衡、灰度等級，確保圖像色彩與標(biāo)準(zhǔn)色卡比對偏差≤3%，消除偏色、橫紋等問題。

　　Image calibration: By using specialized software to calibrate white balance and grayscale levels, ensure that the color deviation of the image compared to the standard color card is ≤ 3%, and eliminate problems such as color deviation and horizontal stripes.

　　三、機(jī)械部件維修技術(shù)

　　3、 Mechanical component maintenance technology

　　活動結(jié)構(gòu)維護(hù)：彎曲部卡頓需檢查關(guān)節(jié)軸承，磨損間隙＞0.02mm 時(shí)更換耐磨合金軸承，涂抹無菌潤滑脂防腐蝕。插入管破損用醫(yī)用修補(bǔ)膠修復(fù)，固化 24 小時(shí)后確保表面平整度偏差≤0.1mm。

　　Maintenance of activity structure: If the bending part is stuck, check the joint bearings. If the wear clearance is greater than 0.02mm, replace the wear-resistant alloy bearings and apply sterile lubricating grease to prevent corrosion. Repair the damaged insertion tube with medical repair adhesive, and ensure that the surface flatness deviation is ≤ 0.1mm after 24 hours of curing.

　　通道與密封修復(fù)：活檢通道堵塞用硅膠頭通條清理，0.2MPa 無菌水壓力測試檢測密封性。漏水需更換氟橡膠墊圈（耐溫 - 20-200℃），安裝時(shí)保證 20%-30% 壓縮量。

　　Channel and seal repair: The biopsy channel blockage is cleaned with a silicone head strip, and the sealing is tested by a 0.2MPa sterile water pressure test. If there is water leakage, replace the fluororubber gasket (temperature resistance -20-200 ℃), and ensure a compression rate of 20% -30% during installation.

　　四、消毒與性能校準(zhǔn)技術(shù)

　　4、 Disinfection and Performance Calibration Technology

　　嚴(yán)格消毒流程：酶清洗劑（1%-2% 濃度）浸泡 10 分鐘后，環(huán)氧乙烷（800-1000mg/L）55℃滅菌 6 小時(shí)，通風(fēng)解析 24 小時(shí)至殘留量≤10μg/g。

　　Strict disinfection process: After soaking in enzyme cleaning agent (1% -2% concentration) for 10 minutes, sterilize with ethylene oxide (800-1000mg/L) at 55 ℃ for 6 hours, and ventilate for 24 hours until the residual amount is ≤ 10 μ g/g.

　　精準(zhǔn)校準(zhǔn)：用標(biāo)準(zhǔn)模體檢測，視場角偏差≤2°，分辨率≥1000 線對 /mm，彎曲角度與標(biāo)稱值偏差≤5°。電切功能內(nèi)窺鏡需絕緣測試，泄漏電流≤10μA。

　　Accurate calibration: detected using standard molds, with a field of view angle deviation of ≤ 2 °, a resolution of ≥ 1000 line pairs/mm, and a bending angle deviation of ≤ 5 ° from the nominal value. The electric cutting function endoscope requires insulation testing with a leakage current of ≤ 10 μ A.

　　五、軟件與系統(tǒng)調(diào)試技術(shù)

　　5、 Software and System Debugging Techniques

　　程序與固件維護(hù)：高端設(shè)備程序錯(cuò)誤時(shí)，專用數(shù)據(jù)線連接電腦重裝固件，升級需接備用電源防斷電。

　　Program and firmware maintenance: When there is a program error on high-end devices, a dedicated data cable should be connected to the computer to reinstall the firmware. Upgrading requires connecting to a backup power source to prevent power outages.

　　聯(lián)動測試：調(diào)試各模塊聯(lián)動性（如光源與曝光同步），模擬操作驗(yàn)證響應(yīng)延遲≤0.5 秒，生成含部件型號、校準(zhǔn)數(shù)據(jù)的維修報(bào)告，確保可追溯。

　　Linkage testing: Debug the linkage of each module (such as synchronizing light source and exposure), simulate operation verification response delay ≤ 0.5 seconds, generate maintenance reports containing component models and calibration data to ensure traceability.

　　這些技術(shù)的協(xié)同應(yīng)用，結(jié)合 ISO13485 等規(guī)范，能保障維修后設(shè)備的精度與安全性，有效延長使用壽命。

　　The collaborative application of these technologies, combined with specifications such as ISO13485, can ensure the accuracy and safety of equipment after maintenance, effectively extending its service life.

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